ACER CPU.XEON.X5550.2.66/8M/133/DO
|
ACER CPU.XEON.X5550.2.66/8M/133/DO
€2 354,00
€1 898,39 ex. sales tax
Expected in stock
23.4.2024
|
Description
Specifications
Performance. Efficiency. Agility.
Intel’s newest dual-core processor for dual processor (DP) servers and workstations delivers a new level of energy-efficient performance from the innovative Intel Core microarchitecture, optimized for low-power, dual-core, 64-bit computing.
The Dual-Core Intel Xeon processor 5100 series is ideal for intense computing environments, 32-bit and 64-bit business-critical applications and high-end workstations. Combined with the Intel 5000 chipset family and Fully Buffered DIMM (FBDIMM) technology, the new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 3 times the performance and 3.5 times the performance/watt of previous-generation single-core Intel Xeon processors. The new Dual-Core Intel Xeon processor 5100 series-based platforms are expected to deliver up to 2.25 times the performance and 2.35 times the performance/watt of previous-generation dual-core Intel Xeon processors.
The Dual-Core Intel Xeon processor 5100 series is compatible with Intel 5000P, 5000V and 5000X series of chipsets. Server boards based on these chipsets are optimized for dual core with advanced platform features of Dual Independent Bus and Fully Buffered DIMM memory technology offering up to 4X and 3X available bandwidth of current generation platforms. Improved I/O performance is possible with PCI Express and the option of Intel I/O Acceleration Technology.
Dual-core processing
Significant performance headroom, especially for multi-threaded applications, helps boost system utilization through virtualization and application responsiveness.
Intel Core microarchitecture
Better performance on multiple application types and user environments at a substantially reduce power envelope.
Majority of SKUs at 65W
Significantly lower power (compared to previous generation) helps improve data center density and power/thermal operating costs.
Ultra-dense, ultra low-power SKUs at 40W
Low-voltage SKU available at reduced power envelopes will deliver even higher performance per watt — helps reduce power/thermal operating costs and improve data center density.
4 MB shared L2 cache
Increases efficiency of L2 cache-to-processor data transfers, maximizing main memory to processor bandwidth and reducing latency.
Entire L2 cache can be allocated to one core.
1066 and 1333 MHz system bus
Faster system bus speeds than previous generations for increased throughput.
Intel Virtualization Technology
New processor hardware enhancements that support software-based virtualization, enabling migration of more environments — including 64-bit OSs and applications — to virtual environments.
Intel Extended Memory 64 Technology (Intel EM64T)
Flexibility for 64-bit and 32-bit applications and operating systems.
Enhanced Intel Speedstep Technology
Helps reduce average system power consumption and potentially improves system acoustics.
Processor |
---|
Processor family | Intel® Xeon® 5000 Sequence |
Processor model | X5550 |
Processor base frequency | 2.66 GHz |
Processor cores | 4 |
Processor socket | Socket B (LGA 1366) |
Processor lithography | 45 nm |
Box | No |
Component for | Server/workstation |
Processor threads | 8 |
System bus rate | 6.4 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.06 GHz |
Processor cache | 8 MB |
Processor cache type | L3 |
L3 cache speed | 2.66 GHz |
Thermal Design Power (TDP) | 95 W |
VID Voltage Range | 0.75 - 1.35 V |
Compatible chipsets | Intel® 5500, Intel® 5520 |
Stepping | D0 |
Bus type | QPI |
Number of QPI links | 2 |
Memory bandwidth supported by processor (max) | 32 GB/s |
Processor code | SLBF5 |
Memory |
---|
Maximum internal memory supported by processor | 144 GB |
Memory types supported by processor | DDR3-SDRAM |
Memory clock speeds supported by processor | 800,1066,1333 MHz |
Memory channels | Triple-channel |
ECC | Yes |
Features |
---|
Execute Disable Bit | Yes |
Idle States | Yes |
Market segment | Server |
Number of Processing Die Transistors | 731 M |
Processing Die size | 263 mm² |
CPU configuration (max) | 2 |
Graphics & IMC lithography | 45 nm |
Processor special features |
---|
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® Turbo Boost Technology | Yes |
Intel® Smart Cache | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Operational conditions |
---|
Tcase | 75 °C |
Weight & dimensions |
---|
Processor package size | 42.5 mm |
Other features |
---|
Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
Please note that although care has been taken in the degree of relevancy, pictures are for
display purposes only, and product appearance may differ from what you see. If there are any
discrepancies between the product headline, description and picture, the correct information
will be in the product headline (i.e. computer systems may not come with monitors even if
pictured that way). If anything is unclear, please email support before placing your order.